19 Jul, 2024

Apple to become first customer for Amkor’s $2 billion Arizona chip packaging facility

Amkor, a leading OSAT (outsourced semiconductor assembly and test) service provider, on Tuesday announced plans to build an advanced chip packaging facility in the U.S. The company plans to invest around $2 billion in the new facility, which will be located in Arizona and will be used to package chips produced by TSMC at a fab nearby. Apple […]

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